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Optomec Showcases Production System for Electronics Packaging at IPC APEX

Will have live demonstrations of the company’s Aerosol Jet HD 3D system.

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By: Anthony Locicero

Copy editor, New York Post

Optomec said it will feature its Aerosol Jet HD system for electronics packaging at the IPC APEX Expo/conference (Jan. 29-31 at the San Diego Convention Center).
 
Highlighting its exhibition will be live demonstrations of the company’s Aerosol Jet HD 3D system at booth #2415.
 
The Aerosol Jet HD System is designed to address today’s most demanding electronics packaging challenges, including the increasing density of electronic components. The Aerosol Jet HD System is a compact, configurable production platform that can dispense a wide range of electronic materials with features as small as 20 microns. The system can also produce larger features, from 100’s of microns to millimeters, and print wide-area conformal coatings from 100 nanometers to 10’s of microns in thickness.
 
The Aerosol Jet HD System is based on Optomec’s patented Aerosol Jet technology, a fine-feature material deposition solution used to directly print functional electronic circuitry and components onto low-temperature, non-planar substrates, without the need for masks, screens or subtractive post-processing.  Based on the next-generation of Optomec’s production-proven Aerosol Jet print engine, coupled with in-line automation, the HD System can handle a variety of substrate sizes and compositions, providing high-resolution printed electronics for today’s most demanding advanced packaging applications such as 3D interconnects, conformal RF/EMI shielding, and precision micro-dispense of insulators and adhesives.
 
Examples of functional printed electronics by Optomec customers will also be on display.
 

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